http://www.eetimes.com/electronics-news ... geNumber=0
Worth a read (ignore the PR and read Sun's comments):
TSMC pulled in plans for initial production of its 16-nm FinFET process to the end of 2013. In addition, it hopes to adopt extreme ultraviolet lithography to make 10-nm chips starting in late 2015 but is still researching e-beam as an alternative.
Company executives detailed the new processes and how they aim to get there at an annual symposium here. They also provided an update on their work on 3-D chip stacks and their ongoing ramp of today’s 28-nm process node.
“It looks like we have another 7 to 8 years ahead in advances -- maybe more -- we can see in technology down to 10 and even 7 nm,” said Morris Chang, founder and chief executive of TSMC, speaking to a small group of press after a keynote here.
“Moore’s Law is going to go on and we will be there -- if anyone pursues it, we will pursue it,” he told an audience of several hundred chip designers.
MUCH MORE >>> including that all 3 top foundries (yeah, go GloFo) expect to ship FinFETS this year
Here's a 300mm wafer compared to a 450mm wafer.