Quote:SK Hynix Inc. today introduced the industry's first 72-Layer 256 Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32 GB (Gigabytes) storage. SK Hynix launched 36-Layer 128 Gb 3D NAND chips in April 2016, and has been mass producing 48-Layer 256 Gb 3D NAND chips since November 2016. In just 5 months, the company has developed the 72-Layer 256 Gb 3D NAND chips, securing the industry's finest product portfolio.