Quote:On the consumer side, Samsung now offers 32GB unbuffered DDR4 memory modules. The module (M378A4G43MB1-CTD) clocks in at 2,666MHz with a CAS latency of 19 and an operating voltage of 1.2V, as specified by JEDEC. Technically, AMD's Ryzen Threadripper processors can support up to 2TB of memory. Therefore, it should be possible to run 256GB on the Threadripper platform. Unfortunately, X399 motherboards are only certified to support up to 128GB. However, the 32GB module should open the door for future motherboards with four DDR4 memory slots to house up to 128GB of memory.
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Things get extremely interesting for Samsung's enterprise clients. The 16Gb memory chips have allowed the NAND maker to raise the capacity bar up to 256GB. No, you didn't read that wrong; we're talking about 256GB of memory on a single stick. The module is available in LRDIMM (M386ABG40M50-CYF) and RDIMM (M393ABG40M52-CYF) formats. It operates at 2,933MHz and has a CAS latency of 21 or 24 depending on the model. Despite the huge capacity and frequency, the module's operating voltage adheres to the official JEDEC specification of 1.2V.

Although Samsung's 256GB module is clearly aimed at servers, it's likely just a matter of time before this capacity makes its way to the consumer end.

Quote:The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.

Quote:32-gigabyte DDR4 UDIMMs are a reality. Samsung recently announced the development of a 32 GB DDR4 dual-rank UDIMM, using higher density DRAM chips. Those chips, however, are unlikely to be available anytime soon, compounded by Samsung's reported scumbaggery in the making. In the midst of all this, motherboard major ASUS designed its own non-JEDEC UDIMM standard, called "Double Capacity DIMM" or DC DIMM, with the likes of G.Skill and Zadak designing the first models. The utility of these modules is to max out the CPU memory controller's limit despite having fewer memory slots on the motherboard. Possible use-cases include LGA1151 mini-ITX motherboards with just one slot per memory channel (2 slots in all), or certain LGA2066 boards with just four slots (one slot per channel).

There is no word on the memory chip configuration modules, but it's highly likely they are dual-rank. The first DDR4 DC modules could be 32 GB, letting you max out the memory controller limit of 8th gen and 9th gen Core processors with just two modules. ASUS is heavily marketing this standard with its upcoming motherboards based on Intel's Z390 Express chipset, so it remains to be seen if other ASUS motherboards (or other motherboards in general) support the standard. Ironically, the Zadak-made module shown in ASUS marketing materials use DRAM chips made by Samsung.