03-28-2017, 09:47 PM
https://www.techpowerup.com/231911/amd-1...ridge-dies
Quote:These could include 12-core and 16-core parts, and the picture is getting clearer with an exclusive report by Turkish tech publication DonanimHaber. The biggest revelation here that the 12-core and 16-core Ryzen processors will be multi-chip modules (MCMs) of two "Summit Ridge" dies. The 12-core variant will be carved out by disabling 1 core per CCX (3+3+3+3).
Another revelation is that the 12-core and 16-core Ryzen processors will be built in a new LGA package with pin-counts in excess of 4,000 pins. Since it's an MCM of two "Summit Ridge" dies, the memory bus width and PCIe lanes will be doubled. The chip will feature a quad-channel DDR4 memory interface, and will have a total of 58 PCI-Express gen 3.0 lanes (only one of the two dies will put out the PCI-Express 3.0 x4 A-Link chipset bus). The increase in core count isn't coming with a decrease in clock speeds. The 12-core variant will hence likely have its TDP rated at 140W, and the 16-core variant at 180W. AMD is expected to unveil these chips at the 2017 Computex expo in Taipei, this June, with product launches following shortly after.

