3D XPoint Storage On The Way

[SteelCrysis]

http://www.tomshardware.com/picturestory...7.html#s14

Intel didn’t announce the upcoming 900p at Computex but did take the stage for a brief moment in the spotlight. The 900p looks amazing in the leaked slides, but even as vaporware, it has our vote over the TLC race-to-the bottom we saw all week.

The next-generation consumer SSDs have weak controller designs with low core counts. Most of the processing power will be used by powerful error correction technology needed to ensure product life from 1,000 to 1,500 P/E cycle 3D TLC. NAND flash companies plan to erase MLC from the board in the 3D era. That will push many of our readers to Intel’s 3D Xpoint technology used in the proposed 900p and Optane Memory paired with hard disk drives.

Enthusiasts and early adopters who funded a large portion of the NAND development over the last decade will find 3D TLC a bust at this stage. In the future, we may see stronger products designed for enthusiasts, gamers, and power users, but for now we have only two viable alternatives: Samsung V-NAND and Intel Optane. Samsung didn’t display any products publicly at Computex, so Intel gets the pudding this time around.