05-04-2018, 10:18 PM
Also mentioned:
Quote:At its 24th annual Technology Symposium in Santa Clara, TSMC announced its Wafer-on-Wafer (“WoW”) technology, which could be a boon for GPU performance, similar to how vertical stacking has improved DRAM manufacturing and performance. The technology, as the name suggests, stacks layers of logic on top of one another using a through-silicon via (“TSV”) interconnect. With limited lateral space on wafers, WoW technology should allow for faster chips with higher areal density to be crammed in the same amount of space using high-speed, low-latency interconnects.
Process maturity plays an important role in determining yields, which are currently low for the WoW tech – so expect an initial roll-out on parts built on more mature 16nm or 10nm processes, before transitioning to smaller process nodes. However, as the technology matures and yields improve, GPU manufacturers could literally stack two fully-functional GPUs on top of one another, as opposed to dual-GPU setups using two independent dies, leading to cost savings, and smaller, more power-efficient video cards.