09-28-2019, 09:19 AM
https://www.tomshardware.com/news/tsmc-a...40498.html
Quote:TSMC and Arm announced they developed the industry’s first 7nm chiplet system. The proof-of-concept HPC system is based on multiple high-speed Arm cores and a mesh bus, using TSMC's new LIPINCON inter-chiplet interconnect with CoWoS packaging technology.
Chiplet-based designs are one of the current industry trends. This could be connecting various chiplets to a base die, but for high-performance computing (HPC) it often involves partitioning a big die into multiple smaller chiplets, then using advanced packaging technology to achieve performance as close as possible to monolithic integration. The benefit is improved overall yield, and thus cost, due to the smaller silicon dies, although the advanced packaging cost can offset the savings somewhat.
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TSMC says the system taped out in December 2018 and was produced in April 2019 (which gives a rough indication of 7nm's cycle time). TSMC provided more details of the design at the 2019 VLSI.