10-09-2019, 03:10 AM
https://www.tomshardware.com/news/tsmc-a...40575.html
https://www.techpowerup.com/259890/tsmc-...technology
Quote:TSMC today announced that its N7+ process is going to market in high volume, and the company already has customers lined up, including AMD, which has stated publicly that it will use the new 7nm+ process for its future Zen 3-based chips.
It’s not "just" TSMC’s first process that uses the long-awaited extreme ultraviolet (EUV) lithography, TSMC also claims that N7+ is the industry’s first commercially available EUV process. The company did not clarify which products will use the new chips.
...
TSMC claims that its N7+ production is one of its fastest ever, which presumably means in terms of yield learning, as TSMC then goes on to say that N7+ is already matching yields of the original 7nm process from 2018 that debuted with Apple’s A12 chip. N7+ went into volume production in May and will be followed by the slightly improved N6 by the end of 2020, with similar density of N7+ but full design rule compatibility to N7.
https://www.techpowerup.com/259890/tsmc-...technology
Quote:Building on its successful experience, N7+ sets a path for future advanced process technologies. TSMC will bring N6 technology into risk production in the first quarter of 2020 for volume production by the end of the year. With further application of EUV, N6 will offer 18% higher logic density over N7, and design rules fully compatible with N7 enable customers to greatly shorten time-to-market.

