Alder Lake Discussion Thread

[SteelCrysis]

https://www.tomshardware.com/news/intel-...pus-socket

We've hardly had a moment to catch our breath since Intel formally announced the Comet Lake-S desktop CPUs, but new rumors are already streaming in about future Intel products. The latest claims Alder Lake-S chips will drop into a new socket known as LGA1700.

The information comes courtesy of the Taiwanese lit-tech, where the company listed a product entry for an LGA1700 interposer and noted that it is for the Alder Lake-S platform.
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However, Alder Lake-S featuring a new socket wouldn't be that surprising. Alder Lake-S chips are expected to feature a whole new design, with rumors pointing to a big.Little architecture. This is a hybrid architecture featuring small, efficient Gracemont cores paired with an equal number of big, punchy and power-hungry Golden Cove cores. In a way, the design is similar to Intel's Lakefield platform, which will be the first to feature Intel's Foveros 3D stacking technology on a CPU.

Because of its increased pin count, the LGA1700 socket is also expected to grow in size, as was tweeted by hardware leaker @Komachi_ensaka in January. Whereas the LGA1151 and LGA1200 sockets measure 37.5 x 37.5mm, LGA1700 is expected to maintain the same width but grow slightly taller to 45mm. Unfortunately, this radically new socket design would also mean that existing CPU coolers likely won't be compatible without tweaks.

We previously heard rumors that Alder Lake-S would debut this year, but with Rocket Lake-S still needing to land first, we're not positive on a release date. Plus, at this time Intel hasn't confirmed either upcoming CPU generations, so take information on the rumored chips with a pinch of salt.

https://www.techpowerup.com/266606/intel...e-16-cores

Rumored to feature up to 16 cores, Alder Lake CPUs could present an x86 iteration of the big.LITTLE design, where one pairs eight "big" and eight "small" cores that are activated according to increased or decreased performance requirements, thus bringing the best of both worlds - power efficiency and performance. This design would be present on Intel's 3D packaging technology called Foveros. The Alder Lake CPU support patch was added on April 27th to the Chrome OS repository, which would indicate that Intel will be pushing these CPUs out relatively quickly. The commit message titled "add support for ADL gpiochip" contained the following: "On Alderlake platform, the pinctrl (gpiochip) driver label is "INTC105x:00", hence declare it properly." The Chrome Unboxed speculates that Alder Lake could come out in mid or late 2021, depending on how fast Intel could supply OEMs with enough volume.