02-09-2021, 08:23 AM
https://www.extremetech.com/computing/31...otographed
Quote:These are engineering samples for a CPU we don’t expect to see for 18-24 months, so we’d take them with a shaker of salt more so than a grain, but what we see here is broadly what we’d expect to see. Intel has previously stated it believes its advanced packaging technology is a meaningful differentiator between itself and AMD. We’ll see if AMD pulls its Epyc chiplets back together into a clustered configuration over the next few product generations, but for now it looks like Intel and AMD may pursue different strategies when it comes to handling intra-chip communication.