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96-Layer 3D NAND And QLC NAND
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http://www.anandtech.com/show/11585/west...layer-nand
Quote:Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital feature 96 layers and will include several capacity points and will use TLC and QLC architectures. The company expects to start volume production of BiCS4 chips in 2018.

https://www.techpowerup.com/234729/toshi...ash-memory
Quote:Toshiba America Electronic Components, Inc. (TAEC) today announced the latest generation of its BiCS FLASH three-dimensional (3D) flash memory. The newest BiCS FLASH device features 4-bit-per-cell, quadruple-level cell (QLC) technology and is the first 3D flash memory device to do so. Toshiba's QLC technology enables larger (768 gigabit) die capacity than the company's third-generation 512Gb 3-bit-per-cell, triple-level cell (TLC), and pushes the boundaries of flash memory technology.
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Samples of Toshiba's groundbreaking QLC device began shipping earlier in June to SSD and SSD controller vendors for evaluation and development purposes. Additionally, samples will be showcased at the 2017 Flash Memory Summit, taking place from August 7-10 in Santa Clara, California.
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96-Layer 3D NAND And QLC NAND - by SteelCrysis - 06-29-2017, 08:18 AM

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