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Ryzen Release Thread
Quote:In a development that could explain why Intel is frantically stitching together 10 cores with the "Comet Lake" silicon, a slide leaked from a private event hosted by motherboard major GIGABYTE reveals that AMD's third generation Ryzen desktop platform could launch as early as Computex 2019 (June). The platform will include AMD's first client-segment processor based on its "Zen 2" microarchitecture, codenamed "Matisse," and its companion chipset, the AMD X570.

3rd generation Ryzen with X570 is expected to be the world's first mainstream desktop platform to feature PCI-Express gen 4.0. AMD could maintain the processor's backwards compatibility with older 300-series and 400-series chipset motherboards by shaping its PCI-Express implementation to use external re-drivers based on the motherboard, according to Taiwan-based industry observer Lars Nilsson. This could make 500-series motherboards slightly pricier than current AM4 motherboards. Backwards compatibility could mean unless you really need PCIe gen 4.0, you should be able to save by opting for older motherboards.
Quote:The tease in question was posted by an AMD-contracted Sales agency in South Korea, which launched a campaign inviting users to guess Cinebench scores for upcoming AMD processors: namely, the Ryzen 7 3700X and Ryzen 5 3600X - thus confirming the nomenclature for AMD's upcoming CPUs. The contest finishes on December 14th, and is basically asking users to take a gander on scores for unreleased CPUs - promising prizes of said CPUs when they launch.
Quote:Russian price tracking website e-Katalog has listed AMD's complete upcoming Ryzen 3000-series processor lineup. It’s notable that E-Katalog doesn't sell products. Instead, it lists pricing for a range of items, like household and computer equipment, electronics, home, and office products, much like PCPartPicker.

While the specifications fall in line with the recent AdoredTV leak, these listings could be placeholders and should be taken with a grain of salt. However, if there is any truth to the listings, AMD could really shake up the processor market with the new Ryzen chips.
According to the listings, the Ryzen 3 3300 runs at 3.2GHz with a 4GHz boost clock and 50W TDP (thermal design power), while the Ryzen 3 3300X variant boasts a 3.5GHz base clock and 4.3GHz boost clock with a slightly higher 65W TDP. They are expected to cost no more than $130, which is almost unthinkable for a hexa-core chip.

The Russian website lists the Ryzen 5 3600 at 3.6GHz with a boost clock that reaches 4.4GHz. As for the Ryzen 5 3600X, the chip reportedly has a 4GHz base clock and 4.8GHz boost clock. The non-X variant comes with 65W TDP and the X variant with a 95W TDP.

Going up the Ryzen 3000-series ladder, the Ryzen 7 3700 is listed with a 3.8GHz base clock, 4.6GHz boost clock, and 95W TDP. The higher-end Ryzen 7 3700X flaunts a 4.2GHz base clock, 5GHz boost clock, and 105W TDP.

Lastly, the Ryzen 3800X ticks at 3.9GHz with a 4.7GHz boost clock and is listed with a 125W TDP. On the other hand, the Ryzen 9 3850X is listed with a 4.3GHz base clock and a shockingly-high 5.1GHz boost clock with a 135W TDP rating. However, e-Katalog only listed the first, which could reinforce the rumor that AMD will release the Ryzen 9 3850X at a later date (May 2019).
Quote:Possibly matching Intel's single-threaded performance is a watershed moment for AMD, as that type of workload has long been one of the few areas where the Ryzen processors lagged behind Intel's models. But that isn't all. Su also pointed out that the denser 7nm node allowed the Ryzen processor to consume less power, which ultimately equates to heat, than the Core i9-9900K.

The AMD processor pulled ~30% less power than the Core i9-9900K. That's a tremendous advantage over Intel's processors, which have gained a reputation for requiring high-end motherboards, power supplies, and coolers to extract the optimum level of performance. The Ryzen processors' impressive achievement means that it could be much cheaper to build full systems with AMD's Ryzen 3000-series processors, thus offering a similar level of performance while maintaining the value advantage.
Third-gen Ryzen is coming to market in the "middle of 2019," and Su said that the company would share more details as it comes closer to launch.
Quote:On close inspection of the substrate, we find that while the I/O controller die is somewhat centrally to the side of the package, the sole 8-core CPU chiplet is not located at a similar position (think Intel "Clarkdale" MCMs). On zooming in further, we find that just south of the 8-core CPU chiplet die, there appear to be blank bumps protruding over an area similar to that of a chiplet covered up by the outer layers of the substrate, leading us to conclude that the AM4 package is capable of three dies, an I/O controller, and two 8-core CPU chiplets. There very much will be a 16-core/32-thread Ryzen for the AM4 platform, and it's only a question of when.

The 16-core Ryzen AM4 MCM will be similar in concept to the larger 64-core SP3r2 EPYC/Threadripper MCMs: the CPU dies only pack the CPU cores and an InfinityFabric interface, while the I/O controller die is wired to multiple CPU dies, and manages the memory, PCIe, and SoC connectivity of the processor.
AMD's engineering bravado with "Matisse" also unlocks the possibility of the Ryzen "Raven Ridge" APU successor being an MCM with one 8-core chiplet, and an oversized I/O controller die that packs a "Vega" or "Navi" based iGPU, in addition to memory, PCIe, SoC, and the works. Dies on that package could be arranged differently from this.
Quote:But after speaking with several motherboard vendors here at CES 2019, we've learned that many of them have successfully tested PCIe 4.0 on 300- and 400-series AMD motherboards, meaning that the feature could be enabled with a simple BIOS update, at least partially.

Our sources tell us that after unlocking the feature via a BIOS update, the older motherboards supply a PCIe 4.0 x16 connection to the first slot on the motherboard, but the remainder of the slots revert to PCIe 3.0 signaling rates. That's because any trace routing on the motherboard that exceeds six inches requires newer redrivers and retimers that support PCIe 4.0's faster signaling rates. That means the PCIe slot nearest to the CPU will easily support PCIe 4.0, while the other slots, including M.2 ports, will run at a PCIe 3.0 signaling rate.

The 500-Series chipsets will consume more power than the 28nm chipsets used on current AM4 motherboards, but that's because the 500-series chipsets also support PCIe 4.0. We weren't told the specific lane allocations of the new chipset, but those faster lanes will be useful for numerous types of secondary I/O devices.

Even though multiple board partners have tested PCIe 4.0 on previous-gen chipsets, it remains to be seen if AMD will allow them to expose that functionality via BIOS updates. Our sources tell us that AMD can simply lock out that feature and that the fate of PCIe 4.0 support on 300- and 400-series motherboards haven't been communicated to them yet.
Quote:Update: We spoke with AMD representatives, who confirmed that 300- and 400-series AM4 motherboards can support PCIe 4.0. AMD will not lock the out feature, instead it will be up to motherboard vendors to validate and qualify the faster standard on its motherboards on a case-by-case basis. Motherboard vendors that do support the feature will enable it through BIOS updates, but those updates will come at the discretion of the vendor.
Quote:Thus far, the information we have obtained regarding Ryzen 3000 points toward a likely June launch month, probably right around Computex, with multiple manufacturers confirming the target. AMD is officially stating “mid-year” launch, allowing some leniency for changes in scheduling, but either way, Ryzen 3000 will launch in about 5 months.

The biggest point of consideration for launch has been whether AMD wants to align its new CPUs with an X570 release, which is presently the bigger hold-up of the two. It seems likely that AMD would want to launch both X570 motherboards and Ryzen 3000 CPUs simultaneously, despite the fact that the new CPUs will work with existing motherboards provided they’ve received a BIOS update.
Quote:A quick update on our previous X570/PCIe story: First off, as pointed out previously, "chipset" wasn't really the right language to use when referring to the X570's induction of "parts" of Epyc -- it's just PCIe 4.0, more or less, that's moving over. We had a few people reach out to us and confirm that the chipset will almost certainly be running PCIe 4.0, responsible for the power requirement increase and for potential logistical challenges.

Separately, on core counts, our engineering contacts within the industry have informed us that we should expect 16C and 12C CPUs with Ryzen 3000, in addition to the usual 8-core parts. It's just a question of if those launch altogether or independently.
Quote:It's encouraging to hear that AMD's next round of Ryzen chips will not need specific new software enhancements to accommodate the design, as that was a key concern when the first-gen chips arrived. AMD has said that it will release the new third-gen Ryzen processors in mid-2019, which lines up nicely with Computex. As with AMD's previous big launches, we expect more information to come to light slowly in the intervening months as the company builds the hype for its newest round of processors.
Quote:There's been plenty of speculation that AMD's new 7nm third-gen Ryzen processors could come equipped with more than the eight cores the company showed off at its recent CES keynote, and prolific database-detective TUM_APISAK's discovery of a 12-core 24-thread AMD engineering sample in the UserBenchmark database will certainly further the theory.
The test result lists the 12-core 24-thread engineering sample with a 3.4 GHz base clock and a 3.6 GHz average boost during the test. The 2D3212BGMCWH2_37/34_N product identifier lists the peak boost clock as 3.7 GHz, and the TDP rating as 105W. We're expecting higher turbo speeds from the third-gen Ryzen processors, the current gen tops out at 4.3 GHz, but early silicon typically comes with dialed back frequencies as vendors fine-tune the design. In other words, these results likely aren't representative of the final clock speeds.
The chips' single-core floating point score is also telling - at 130 points it outstrips a current-gen Ryzen 7 2700X (at roughly the same clocks) by ~13%, an improvement likely born of improved instruction per clock (IPC) throughput. That implies this chip comes with the Zen 2 microarchitecture.
Quote:It's being reported now that ASMedia will develop some, if not all 500-series chipsets, with the exception of X570. The X570 will be an in-house design by AMD, which will use its own foundry partners (likely GloFo 14 nm) to manufacture it. This presents AMD with an opportunity to harden it against vulnerabilities, and have greater control over pricing, not to mention overcoming key design shortfalls of "Promontory," such as downstream PCIe connectivity.
Sources also mention that ASMedia-supplied chipsets will only hit the market toward the end of 2019, which means AMD X570 could be the only 500-series chipset option between the mid-2019 launch of 3rd generation Ryzen, and late-2019. You should be able to run these processors on older socket AM4 motherboards via BIOS updates, though.
Quote:However, there's just one inconsistency with Digitimes' report: the time frame. The article says ASMedia will not complete the tape-out for PCIe 4.0 until the end of the year. However, the penultimate paragraph claims ASMedia will roll out tape-outs for PCIe 4.0 by the end of of the year.

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