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128-Layer 3D NAND
#1
https://www.techpowerup.com/253373/toshi...nand-flash
Quote:Toshiba and its strategic ally Western Digital are readying a high-density 128-layer 3D NAND flash memory. In Toshiba's nomenclature, the chip will be named BiCS-5. Interestingly, despite the spatial density, the chip will implement TLC (3 bits per cell), and not the newer QLC (4 bits per cell). This is probably because NAND flash makers are still spooked about the low yields of QLC chips. Regardless, the chip has a data density of 512 Gb. With 33% more capacity than 96-layer chips, the new 128-layer chips could hit commercial production in 2020-21.
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#2
https://www.techpowerup.com/256285/nand-...cbrication
Quote:A report from DigiTimes pits NAND manufacturers as accelerating their 120/128 layer 3D NAND technologies, aiming for volume production as early as 2020. Even as SK Hynix has begun sampling its 96-layer 4D NAND flash in March, Toshiba and Western Digital already had plans to introduce 128-layer technology, built on a TLC (Triple Level Cell) process technology so as to increase density while avoiding yield issues present with current QLC (Quad Level Cell) implementations.

The decision to accelerate deployment of the next generation of NAND comes from the fact that the market still faces an oversupply of NAND flash, mostly driven by the mature process of 64-layer NAND technology. With new technologies, higher ASPs and lower production scales are sustainable, which should enable supply to reduce enough so as to increase pricing of NAND-based technologies - and allow manufacturers to somewhat reset asking prices for new NAND chips.
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#3
https://www.techpowerup.com/256836/sk-hy...layer-nand
Quote:SK hynix Inc. announced today that it has developed and started mass-producing the world's first 128-Layer 1 Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year.
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The new product provides the industry's highest density of 1 Tb for TLC NAND Flash. A number of companies including SK hynix have developed 1 Tb QLC (Quad-Level Cell) NAND products, but SK hynix is the first to commercialize the 1 Tb TLC NAND Flash. TLC accounts for more than 85% of the NAND Flash market with excellent performance and reliability.
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The Company also intends to start mass production of a 2 TB client SSD with an in-house controller and software in the first half of next year. 16 TB and 32 TB Non-Volatile Memory express (NVMe) SSDs for cloud data centers will be released next year as well.
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#4
https://www.techpowerup.com/259941/micro...ash-memory
Quote:Micron Technology has taped out its 4th generation 3D NAND flash memory with 128 layers. This paves the way for mass production and product implementations in 2020. The 4th gen 3D NAND by Micron continues to use a CMOS-under-array design, but with Replacement Gate (RG) Technology instead of Floating Gate, which Micron and the erstwhile IMFlash Technology had been using for years. Micron is currently mass-producing 96-layer 3D NAND flash, and TLC remains the prominent data-storage physical layer despite the advent of QLC (4 bits per cell).

Micron comments that this 4th gen 128-layer 3D NAND will be a stopgap restricted to a select few applications, and may not see the kind of adoption as its current 96-layer chips.
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#5
https://www.tomshardware.com/news/sk-hyn...er-4d-nand
Quote:At CES 2020, the Korean semiconductor company SK Hynix Inc plans to expand the company’s reach in the consumer market. SK Hynix will have its latest SSDs, the Gold P31 and Platinum P31 PCIe NVMe SSDs, on display.
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The company will introduce two new PCIe NVMe SSDs into the mix that cater to those seeking higher performance for gaming and multimedia editing workflows. Both drives are built using the company’s latest 128-Layer '4D NAND' flash. The new flash is making its way to market rather quickly, as SK Hynix just announced it six months ago.
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