11-06-2018, 11:23 PM
https://techreport.com/news/34238/sk-hyn...d-tlc-nand
Quote:As traditional silicon scaling has stopped paying dividends for flash-storage density, NAND makers have packed more and more bits into their flash packages by layering more and more sheets of flash memory on top of one another. Today, SK Hynix is joining the elite 96-layer club with its "CTF-based 4D NAND flash." While that "4D" descriptor is purely fluff, the company is in fact producing many-layered charge-trap NAND (as opposed to the floating-gate tech favored by Intel and Micron). Those 96-layer stacks allow the company to pack 512 Gb (64 GB) of TLC flash into a single memory chip.
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Hynix plans to introduce 1-TB SSDs using its 4D flash and in-house controllers later this year. Looking to 2019, the company plans to introduce UFS 3.0 mobile SSDs with this flash in the first half of the year, and enterprise SSDs with this technology in the second half. Hynix also plans to introduce 1-Tb flash packages using 96-layer technology and products using QLC NAND next year.