Intel Completes 32nm Process Development Phase
Intel has officially announced that they have completed the development phase of their next generation 32nm manufacturing process. This will allow for CPUs to be engineered with denser and higher performing transistors while also being more energy efficient.
Intel’s “tick-tock” strategy has so far been on track for the last three years in which it has followed:
- Tick – Core 2 Architecture (65nm)
- Tock – Core 2 Die Shrink (45nm)
- Tick – Core i7 Architecture (45nm)
- Tock – Core i7 Die Shrink (32nm)*
* – This is the next step for Intel which is expected to be on the market in Q4 2009.
If everything stays on course, this will be the fourth year in a row that Intel has remained on schedule with its releases. With the new 32nm process should come improved performance and thermals. Interesting times are ahead.
You can get more detailed information directly from the source:
www.intel.com/pressroom/archive/releases/20081209corp.htm?iid=pr1_releasepri_20081209_r
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Leon Hyman
ABT Editor
